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Layered Biomimetic Composites from MXenes with Sequential Bridging.
1Department of Chemical Engineering, Biointerfaces Institute, Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI, 48109, USA.
Angewandte Chemie (International Ed. in English)
|January 19, 2022
Summary
Researchers developed a new method to create high-performance layered nanocomposites without performance-reducing voids. This technique uses sequential nanoscale bonding and covalent bridging for continuous 2D platelet assembly.
Area of Science:
- Materials Science
- Nanotechnology
- Composite Materials
Background:
- Layer-by-layer (LbL) assembly is a common method for creating layered nanocomposites using various nanomaterials.
- Alternative methods like vacuum-assisted filtration and blade coating are simpler but introduce voids, compromising performance.
- Voids in layered nanocomposites, particularly Ti3C2Tx MXene composites, significantly hinder their overall performance.
Purpose of the Study:
- To address the issue of voids in layered nanocomposites.
- To develop a novel self-assembly strategy for creating continuous, high-performance 2D platelet-based nanocomposites.
- To investigate void elimination in Ti3C2Tx MXene composites.
Main Methods:
- Sequential nanoscale bonding of Ti3C2Tx MXene platelets with sodium carboxymethyl cellulose.
- Covalent bridging using borate ions to link the bonded platelets.
- Evaluation of the void structure within the resulting MXene composites.
Main Results:
- Successfully eliminated voids in Ti3C2Tx MXene composites.
- Demonstrated a new pathway for self-assembling 2D platelets into continuous layered nanocomposites.
- Achieved high-performance nanocomposites by resolving the fundamental problem of voids.
Conclusions:
- Sequential nanoscale bonding and covalent bridging effectively create void-free, continuous layered nanocomposites.
- This approach offers a new strategy for fabricating high-performance 2D platelet-based materials.
- The findings pave the way for advanced applications requiring robust and void-free nanocomposite structures.

