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Research on Heat Dissipation of Multi-Chip LED Filament Package.

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Optimizing multi-chip Light-Emitting Diode (LED) packages involves material and structural changes for better heat dissipation. Improved chip distribution enhances thermal performance, illuminance, and uniformity.

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Area of Science:

  • Optoelectronics and Photonics
  • Thermal Management in Electronics
  • Solid-State Lighting

Background:

  • Multi-chip Light-Emitting Diode (LED) packages are crucial for high-power lighting applications.
  • Effective heat dissipation is critical for LED performance, longevity, and reliability.
  • Optimizing illuminance and uniformity alongside thermal management presents a significant engineering challenge.

Purpose of the Study:

  • To investigate the impact of substrate material, structure, chip distribution, and array form on the thermal performance of multi-chip LED packages.
  • To analyze how structural modifications influence heat dissipation capacity and LED illuminance.
  • To identify optimal configurations for enhanced thermal management and light output quality.

Main Methods:

  • Utilized finite element analysis (FEA) for simulating thermal behavior.
  • Employed steady-state thermal analysis to evaluate heat dissipation under operational conditions.
  • Applied LED illuminance and uniformity theories to compute optical performance metrics for various designs.

Main Results:

  • Substrate material and structural changes significantly affect heat dissipation capacity.
  • Altering LED array forms had a minimal impact on overall heat dissipation.
  • Optimized spatial chip distribution effectively mitigated substrate temperature superposition, enhancing illuminance and uniformity.

Conclusions:

  • Strategic selection of substrate materials and package structures is key to improving LED thermal management.
  • Fine-tuning chip spatial distribution, particularly in combined, equidistant, or S-type equal difference modes, significantly boosts both heat dissipation and light output quality.
  • The S-type equal difference chip distribution mode demonstrated superior illumination and high uniformity, alongside improved thermal performance.