The effect of etching techniques on cement penetration into dentinal tubules on fiber post cementation

A combination of self-etch and additional etch techniques as pre-cementation procedures for fiber post restoration was reported able to increase the bonding of adhesive material. This research aimed to determine the effects of different etching techniques on resin cement penetration into dentinal tubules.

Thirty-two endodontic treated premolars were prepared for 10 mm fiber posts and were divided into two groups (n = 16). Group one was treated with self-etch only, and the second was treated with a combination of self-etch and additional etching. The fiber posts were cemented using fluorescent rhodamine B 0.1%-colored resin cement. The samples were cut to a 2 mm thickness in the middle third of the root and were evaluated with confocal laser scanning microscopy (CLSM). Statistical analysis measurements were analyzed by an independent t-test and Pearson correlation test.

There were statistically different in densities hybrid layer and resin tag penetration lengths. Statistically strong linear positive correlations between the hybrid layer density and resin tag penetration length in both groups were also observed. Hybrid layer density (9.68 μm), resin tag penetration depth (32.51 μm) in the self-etch group with additional etching were higher than in the other group. The Pearson correlation test results between hybrid bond density and resin tag penetration depth in the self-etch treatment group showed a value of r = 0.634 and p-value = 0.008 and in the etching group self-treatment with additional etching a value of r = 0.516 and p-value = 0.041 (p ≤ 0.05).

There is a statistically significant positive correlation or linear relationship between hybrid bond density and the penetration depth of resin tags in both treatment groups: the thicker the hybrid layer density, the deeper the penetration of the resin tags. This phenomenon may increase mechanical strength regarding stronger binding of resin cement to a tooth's substrate.