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A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
Jintao Wang1,2,3, Xinjie Wang1,2,3, Lin Zhang1,2,3
1Department of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China.
Materials (Basel, Switzerland)
|February 15, 2022
Summary
This study developed a novel soldering material using copper-tin (Cu@Sn) core-shell powder and silver nanoparticles (Ag NPs) for advanced semiconductor applications. The resulting joints exhibit excellent shear strength and thermal cycle resistance, indicating enhanced reliability.
Area of Science:
- Materials Science
- Nanotechnology
- Semiconductor Manufacturing
Background:
- Developing reliable soldering materials is crucial for the performance and longevity of third-generation semiconductors.
- Traditional soldering materials often face challenges with joint integrity under thermal stress.
Purpose of the Study:
- To create an advanced soldering material for third-generation semiconductors using Cu@Sn core-shell powder and Ag NPs.
- To investigate the mechanism behind enhanced joint properties and reliability.
Main Methods:
- Preparation of 3-5 μm Cu@Sn core-shell powder via chemical plating.
- Formulation of a soldering material by mixing Cu@Sn powder with Ag NPs.
- Evaluation of joint shear strength and performance over 600 thermal cycles (-40 °C to 140 °C).
Main Results:
- Soldering material joints demonstrated a shear strength exceeding 40 MPa at 25 °C.
- Joints maintained integrity after more than 600 thermal cycles between -40 °C and 140 °C.
- A novel mechanism involving energy potential differences promoting particle pre-melting and reduced porosity was identified.
Conclusions:
- The developed Cu@Sn/Ag NP soldering material offers superior mechanical and thermal reliability for third-generation semiconductors.
- The unique particle interaction mechanism enhances sintered layer quality and bond strength.
- This material presents a promising solution for demanding semiconductor packaging applications.
