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Materials Engineering for Flexible Metallic Thin Film Applications
Megan J Cordill1,2, Patrice Kreiml1, Christian Mitterer2
1Erich Schmid Institute for Materials Science, Austrian Academy of Sciences, 8700 Leoben, Austria.
Materials (Basel, Switzerland)
|February 15, 2022
Summary
Advanced metallic thin film deposition methods enable robust, long-lasting flexible sensors and displays. Materials engineering tailors properties like residual stress and microstructure for enhanced fracture and electrical reliability in bendable devices.
Area of Science:
- Materials Science
- Mechanical Engineering
- Electrical Engineering
Background:
- Flexible, bendable, and stretchable electronic devices are increasingly prevalent.
- Existing fabrication methods for flexible thin film systems can be complex.
- Materials engineering offers an alternative approach using advanced metallic thin film deposition.
Purpose of the Study:
- To review materials engineering concepts for metallic films in flexible devices.
- To discuss electro-mechanical testing aspects of these films.
- To provide scalable methods for creating robust metal thin films for flexible applications.
Main Methods:
- Tailoring residual stress, film thickness, and microstructure.
- Controlling film properties through deposition parameters.
- Utilizing advanced metallic thin film deposition techniques.
Main Results:
- Achieved increased fracture and deformation strains in flexible film systems.
- Enhanced electrical and mechanical reliability of flexible devices.
- Demonstrated the generation of long-lasting flexible film systems.
Conclusions:
- Materials engineering via metallic thin film deposition is key for robust flexible electronics.
- Controlled tailoring of film properties leads to superior device performance and longevity.
- Sustainable and scalable methods can be developed for advanced flexible applications.
