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Metallization, Material Selection, and Bonding of Interconnections for Novel LTCC and HTCC Power Modules

Aleksander Sešek1, Kostja Makarovič2,3,4

  • 1Faculty of Electrical Engineering, University of Ljubljana, Tržaška Cesta 25, SI-1000 Ljubljana, Slovenia.

Materials (Basel, Switzerland)
|February 15, 2022
PubMed

Keywords:
3D LTCC structuresLTCC baseplatepower bondspower modules

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