Demonstration of Fully Integrable Long-Range Microposition Detection with Wafer-Level Embedded Micromagnets.
Björn Gojdka1, Daniel Cichon2, Yannik Lembrecht1
1Fraunhofer Institute for Silicon Technology ISIT, Fraunhoferstr. 1, 25524 Itzehoe, Germany.
Micromachines
|February 25, 2022
Summary
This study presents a novel, fully integrable magnetic microposition detection system for microelectromechanical systems (MEMS). The new system combines CMOS Hall sensors with wafer-level micromagnets, achieving high precision for microdevice applications.
Area of Science:
- Microfabrication and Microsystems Engineering
- Magnetic Sensor Technology
- Nanotechnology
Background:
- Current magnetic position detection methods for miniaturized systems often rely on hybrid-mounted magnets, limiting integration.
- There is a need for fully integrable magnetic sensing solutions for microdevices like MEMS.
Purpose of the Study:
- To demonstrate a fully integrable magnetic microposition detection system.
- To present a novel combination of Hall sensors and wafer-level integrable micromagnets.
- To achieve high-precision 1D and 3D trajectory measurements for microdevices.
Main Methods:
- Integration of CMOS Hall sensors with wafer-level micromagnets.
- Development of a novel micromagnet fabrication process compatible with wafer-level integration.
- Real-time 1D and 3D trajectory measurements using the integrated system.
Main Results:
- Achieved <10 µm precision in 1D measurements over 1000 µm distance.
- Demonstrated <50 µm precision for complex 3D trajectory resolution in real-time.
- Successfully integrated CMOS Hall sensors with wafer-level embedded micromagnets.
Conclusions:
- The demonstrated magnetic microposition detection system is fully integrable for microdevices.
- This technology enables precise real-time tracking of complex movements in miniaturized systems.
- Potential applications include scanners, switches, valves, flow regulators, endoscopes, and tactile sensors.
