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Influence of Ambient Temperature on Part Distortion: A Simulation Study on Amorphous and Semi-Crystalline Polymer
Anto Antony Samy1, Atefeh Golbang1, Eileen Harkin-Jones1
1Engineering Research Institute, Ulster University, Shore Road, Newtownabbey BT37 0QB, Co. Antrim, UK.
Increasing ambient temperature reduces residual stress in 3D printed acrylonitrile-butadiene-styrene (ABS) and polypropylene (PP). However, higher temperatures increase warpage in PP due to crystallization and shrinkage, unlike ABS.
Area of Science:
- Materials Science
- Polymer Science
- Additive Manufacturing
Background:
- Semi-crystalline polymers exhibit higher residual stress and warpage than amorphous polymers due to their crystalline structure.
- Fused Deposition Modeling (FDM) processing parameters, particularly ambient temperature, significantly influence residual stresses and part distortion.
Purpose of the Study:
- To investigate the impact of ambient temperature on residual stresses and warpage in acrylonitrile-butadiene-styrene (ABS) and polypropylene (PP) during FDM.
- To compare the behavior of amorphous ABS and semi-crystalline PP under varying ambient temperatures.
Main Methods:
- Experimental investigation of FDM processing parameters.
- Controlled variation of ambient temperature (50°C, 75°C, 120°C).
- Measurement of in-built residual stresses and part warpage for ABS and PP.
Main Results:
- Increasing ambient temperature decreased residual stress in ABS (0.22-0.37 KPa) with no significant warpage change.
- For PP, increasing ambient temperature reduced residual stress (0.5-2 MPa) but increased warpage (3-3.4%).
- Reduced thermal gradients contributed to lower residual stress in both polymers.
Conclusions:
- Ambient temperature is a critical factor affecting residual stress and warpage in FDM printed parts.
- The enhanced warpage in PP at higher temperatures, despite reduced stress, is attributed to crystallization and shrinkage.
- Understanding these effects is crucial for optimizing FDM processes for different polymer types.
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