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Updated: Sep 30, 2025

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
Carlos M Fernandez1, Joel Alves1, Pedro Dinis Gaspar1,2
1Department of Electromechanical Engineering, University of Beira Interior, Rua Marquês de D'Ávila e Bolama, Covilhã, Portugal.
Smart packaging, utilizing indicator technologies, sensors, and data carriers, offers solutions to reduce food waste and greenhouse gas emissions. This review explores its application in agro-industrial sectors for enhanced efficiency and safety.
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