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Defect Engineering in Thickness-Controlled Bi2O2Se-Based Transistors by Argon Plasma Treatment
Ming Gao1, Wei Wei1, Tao Han1,2
1Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, 117583 Singapore.
ACS Applied Materials & Interfaces
|March 23, 2022
Summary
Researchers developed a method to thin two-dimensional bismuth oxychloride (Bi2O2Se) nanoflakes using Ar+ plasma, improving field-effect transistor performance. UV O3 treatment passivates defects, enhancing the on/off ratio and mobility for potential nonvolatile memory applications.
Area of Science:
- Materials Science
- Nanotechnology
- Condensed Matter Physics
Background:
- Two-dimensional (2D) materials offer unique electronic properties.
- Controlling the thickness and defects of 2D materials is crucial for device performance.
- Bismuth oxychloride (Bi2O2Se) is a promising 2D material for electronics.
Purpose of the Study:
- To develop a controllable method for thinning Bi2O2Se nanoflakes.
- To investigate the effect of thickness and defects on the electronic properties of Bi2O2Se field-effect transistors (FETs).
- To explore the potential of Bi2O2Se FETs for nonvolatile memory applications.
Main Methods:
- Thinning of Bi2O2Se nanoflakes using Ar+ plasma treatment.
- Surface morphology and crystalline quality analysis using Atomic Force Microscopy (AFM) and Raman spectroscopy.
- Defect passivation using UV O3 treatment and characterization via X-ray Photoelectron Spectroscopy (XPS).
- Fabrication and characterization of bottom-gate Bi2O2Se-based FETs.
- Analysis of electronic transport properties using a parallel resistor model.
- Investigation of gate-source/drain voltage hysteresis and its dependence on UV irradiation.
Main Results:
- Ar+ plasma treatment uniformly thinned Bi2O2Se nanoflakes with minimal impact on surface morphology and crystallinity.
- UV O3 treatment effectively passivated oxygen and selenium vacancies created during etching.
- The on-current/off-current (Ion/Ioff) ratio of Bi2O2Se FETs increased with decreasing thickness and was further improved by UV O3 treatment.
- Thickness-controlled Bi2O2Se FETs achieved a high Ion/Ioff ratio of 6.0 × 10^4 and field-effect mobility of 5.7 cm^2 V^-1 s^-1.
- Electronic transport properties were well described by a parallel resistor model.
- Clockwise hysteresis was observed before UV irradiation, attributed to charge trapping/detrapping at the interface and in the bulk.
- Anticlockwise hysteresis was observed after UV irradiation, linked to tunneling between deep-level oxygen defects in SiO2 and the Si gate.
Conclusions:
- A simple, effective, and controllable method for thinning Bi2O2Se nanoflakes was established.
- Thickness control and defect passivation significantly enhance the performance of Bi2O2Se FETs.
- The observed hysteresis characteristics suggest potential applications of Bi2O2Se-based devices in nonvolatile memory.
Keywords:
Ar+ plasma etchingclockwise and anticlockwise hysteresiselectronic transport propertiesfield-effect transistortwo-dimensional Bi2O2Se nanoflake
