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Electrical Properties of Aluminum Nitride Thick Films Magnetron Sputtered on Aluminum Substrates
Daniele Desideri1, Enrico Bernardo2, Alain Jody Corso3
1Department of Industrial Engineering, University of Padova, via Gradenigo 6/a, 35131 Padova, Italy.
Abstract:
The realization of a c-axis oriented aluminum nitride thick film on aluminum substrates is a promising step in the development of transducers for applications with a working temperature up to about 600 °C. The present paper deals with the realization of AlN thick films by means of reactive magnetron sputtering with a pulsed DC power supply, operating in continuous mode for 50 h. Two values (0.4 and 0.8) of nitrogen concentration were used; operative pressure and power were set at 0.3 Pa and 150 W, respectively. The thickness of the obtained aluminum nitride films on the aluminum substrate, assessed with a profilometer, varied from 20 to 30 µm. The preferential orientation of AlN crystals was verified by X-ray diffraction. Finally, as the main focus of the investigation, the films underwent electrical characterization by means of an LCR-meter used on a parallel plate capacitor set-up and a test system based on a cantilever beam configuration. AlN conductivity and ε33 permittivity were derived in the 100 Hz-300 kHz frequency range. Magnetron sputtering operation with nitrogen concentration equal to 0.4 resulted in the preferred operative condition, leading to a d31 piezoelectric coefficient, in magnitude, of 0.52 × 10-12 C/N.
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