Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate-Oxygen System: A Kinetic Approach

The present work is related to the treatment of crushed waste of printed circuit boards (WPCBs) from electrical and electronic devices (WEEE), carrying out the recovery of copper in solution. In the first stage, the studied material was characterized by AAS, SEM-EDS, and XRD. The results revealed significantly high amounts of copper (744.42 mg/g), compared with the rest of the metals present in the sample, mainly iron and zinc. In the second stage of the work, alkali dynamic leaching experiments were carried out in the S2O3−2− O2 medium, evaluating important kinetic variables in order to verify the controlling step of the system and adjust the data to a kinetic model. According to the results obtained from the various experimental tests executed, it was found that in the studied system of S2O3−2− O2, the leaching of copper was preferably adjusted to the model of spherical particles with a shrinking core finding a mixed chemical−diffusive control, with values of Ea = 25.78 kJ/mol and n = 0.22 (for the leaching reagent), indicating that the reaction was controlled by the oxygen transport to the solid−liquid interface and also by the chemical reaction in the surface of particles, obtaining up to 99.82% copper in solution.