Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Evaluating and predicting of the cardiac function class and re-hospitalization in CHD with HF using IVC diameter and collapsibility index.

Scandinavian cardiovascular journal : SCJ·2026

Same author

DNM1L depletion leads to accelerated heteroplasmy shifting of m.10191C allele through ATG7-dependent pathways.

Mitochondrion·2026

Same author

Four-dimensional flow MRI for identifying high-risk esophageal varices: a comparison and combination with spleen volume and splenic extracellular volume fraction.

Insights into imaging·2026

Same author

Heme oxygenase-1 activation in mononuclear phagocytes in acute Kawasaki disease.

Frontiers in pediatrics·2026

Same author

Identification of microRNAs associated with defense against Bursaphelenchus xylophilus in Pinus koraiensis and their potential as early diagnostic targets for pine wilt disease.

Pest management science·2026

Same author

Overcoming the thermo-refractive noise limit for a full-spectrum Hertz-linewidth microcomb.

Nature communications·2026

Same journal

RETRACTED: Articles from the Special Issue "Effect of Hot Manufacturing Methods on Material Processing by Finite Element Modelling".

Materials (Basel, Switzerland)·2026

Same journal

Correction: Yang et al. Microstructural Characteristics of High-Pressure Die Casting with High Strength-Ductility Synergy Properties: A Review. <i>Materials</i> 2023, <i>16</i>, 1954.

Materials (Basel, Switzerland)·2026

Same journal

Effect of La and Ce Microalloying on the Corrosion Resistance of 0.4Sb Low-Alloy Steel in a Harsh Marine Atmospheric Environment.

Materials (Basel, Switzerland)·2026

Same journal

High-Temperature Properties of Magnesium Ammonium Phosphate Cement Modified with Gold Tailings.

Materials (Basel, Switzerland)·2026

Same journal

A Study on the Evolution of Intermetallic Phase Microstructure and High-Temperature Creep Behavior in Mg-8.0Al-1.0Nd-1.5Gd-Mn Alloys.

Materials (Basel, Switzerland)·2026

Same journal

Material-Driven Clinical Complications in Mechanical Circulatory Support: From Blood-Material Interactions to Device-Related Adverse Events.

Materials (Basel, Switzerland)·2026

See all related articles

Search research articles

Related Experiment Video

Updated: Sep 27, 2025

Simulation, Fabrication and Characterization of THz Metamaterial Absorbers

Simulation, Fabrication and Characterization of THz Metamaterial Absorbers

Published on: December 27, 2012

Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting.

Ying Meng^1,2, Runhua Gao¹, Xinhua Wang^1,2,3

¹High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.

Materials (Basel, Switzerland)

|April 12, 2022

Summary

This summary is machine-generated.

This study introduces a novel oxygen plasma and wetting method for polymer adhesive bonding in 3D integration. This technique overcomes misalignment issues, enabling rapid, low-temperature, void-less bonding of polyimides.

Keywords:

3D integration hybrid bonding hydrophilic plasma activation polyimide bonding

More Related Videos

Fabricating Reactive Surfaces with Brush-like and Crosslinked Films of Azlactone-Functionalized Block Co-Polymers

Fabricating Reactive Surfaces with Brush-like and Crosslinked Films of Azlactone-Functionalized Block Co-Polymers

Published on: June 30, 2018

Self-assembling Morphologies Obtained from Helical Polycarbodiimide Copolymers and Their Triazole Derivatives

Self-assembling Morphologies Obtained from Helical Polycarbodiimide Copolymers and Their Triazole Derivatives

Published on: February 7, 2017

Related Experiment Videos

Last Updated: Sep 27, 2025

Simulation, Fabrication and Characterization of THz Metamaterial Absorbers

Simulation, Fabrication and Characterization of THz Metamaterial Absorbers

Published on: December 27, 2012

Fabricating Reactive Surfaces with Brush-like and Crosslinked Films of Azlactone-Functionalized Block Co-Polymers

Fabricating Reactive Surfaces with Brush-like and Crosslinked Films of Azlactone-Functionalized Block Co-Polymers

Published on: June 30, 2018

Self-assembling Morphologies Obtained from Helical Polycarbodiimide Copolymers and Their Triazole Derivatives

Self-assembling Morphologies Obtained from Helical Polycarbodiimide Copolymers and Their Triazole Derivatives

Published on: February 7, 2017

Area of Science:

Materials Science
Surface Chemistry
Microelectronics Engineering

Background:

Polymer adhesives are crucial for dielectric passivation in 3D integration.
Challenges exist with polymer adhesive curing, leading to misalignment issues.
Need for advanced bonding techniques in microelectronics.

Purpose of the Study:

To develop a novel method for adhesive bonding of cured polyimides.
To address misalignment problems in hybrid bonding for 3D integration.
To optimize bonding parameters for enhanced performance and efficiency.

Main Methods:

Utilizing synergistic oxygen plasma surface activation and wetting.
Applying the process to completed cured polyimides.
Characterizing the surface modifications and bonding performance.

Main Results:

Achieved void-less bonding with a maximum shear strength of 35.3 MPa.
Optimized process operates at a low temperature of 250 °C and takes only 2 minutes.
Plasma activation creates hydrophilic groups, enhanced by wetting, facilitating interface bridging.

Conclusions:

The synergistic plasma activation and wetting method provides an effective solution for polyimide adhesive bonding.
This approach significantly reduces bonding time and thermal stress in 3D integration.
Offers a viable alternative for adhesive bonding in advanced microelectronic packaging.