A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads

In this paper, we propose a bistable shock structure based on the thermal actuation principle, which overcomes the response time limitation of heating and cooling in typical thermal actuators and enables a rapid release of energy. Thus, force with a steep rising edge can be applied on a target. Using a bistable shock structure to generate on-chip shock loads, we propose an automated and resettable method for shock testing of microstructures. We characterize the microscale shock process by high-speed camera and finite element simulation (FEM). The method can simulate the dynamic response of key structures in MEMS devices under mechanical shock conditions, and therefore, can be used to evaluate shock fracture strength of microstructures.