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High-Performance Liquid Metal/Polyborosiloxane Elastomer toward Thermally Conductive Applications
Chunyu Zhao1, Yu Wang1, Liang Gao1
1CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China (USTC), Hefei 230027, P. R. China.
ACS Applied Materials & Interfaces
|April 27, 2022
Summary
Researchers developed a novel thermally conductive elastomer by embedding liquid metal (LM) microdroplets into a polyborosiloxane elastomer (PBSE). This composite offers superior stretchability and toughness for advanced applications.
Area of Science:
- Materials Science
- Polymer Science
Background:
- Thermally conductive elastomers are crucial for daily applications but often lack sufficient stretchability and toughness.
- Limitations in current materials hinder their use in demanding practical scenarios.
Purpose of the Study:
- To engineer a high-performance composite material with enhanced mechanical and thermal properties.
- To overcome the limitations of traditional thermally conductive elastomers.
Main Methods:
- Fabrication of a composite by dispersing room-temperature liquid metal (LM) microdroplets into a polyborosiloxane elastomer (PBSE) matrix.
- Characterization of the composite's mechanical properties, including fracture strain and toughness.
- Evaluation of the composite's thermal conductivity and performance under complex loading conditions.
Main Results:
- The LM/PBSE composite achieved a high fracture strain of 401% and fracture toughness of 2164 J/m² due to a solid-liquid coupling mechanism.
- Incorporation of LM microdroplets significantly improved the thermal conductivity of the elastomer.
- The composite demonstrated remarkable anti-impact and adhesion capabilities.
Conclusions:
- The developed LM/PBSE composite represents a novel stretchable elastomer with superior mechanical and thermal performance.
- This material shows significant potential for applications in thermal camouflages, heat-dissipation matrices, and electronic device shells.

