Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

Area of Science:

• Materials Science
• Nanotechnology
• Composite Materials

Background:

• High thermal conductivity is critical for advanced electronic devices, impacting speed and longevity.
• Challenges exist in creating continuous thermal paths and minimizing interface resistance in composites.
• Existing materials struggle to meet the demands of increasingly integrated and high-powered electronics.

Purpose of the Study:

• To develop a thermally conductive composite with enhanced heat dissipation capabilities.
• To overcome limitations in filler content and interface thermal resistance.
• To provide effective thermal management solutions for microelectronics and aerospace.

Main Methods:

• Fabrication of a 3D-oriented carbon fiber (CF) network structure.
• Incorporation of boron nitride (BN) flakes as thermal conductive bridges within the CF network.
• Utilizing vacuum liquid impregnation for epoxy composite preparation.

Main Results:

• Successfully constructed a 3D-oriented BN/CF structure within an epoxy matrix.
• The modified structure broadened heat conduction pathways and reduced thermal resistance.
• Achieved a thermal conductivity of 3.1 W m⁻¹ K⁻¹ for the BN/CF/EP composite (5 vol% CF, 40 vol% BN).

Conclusions:

• The facile and efficient method provides a promising approach for thermal management materials.
• The developed composite offers a viable solution for heat dissipation in demanding applications.
• This research contributes to advancing thermal management in microelectronic and aerospace industries.