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Thermal Measurement Techniques in Analytical Microfluidic Devices

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

Probe-based microscale measurement setup for the thermal diffusivity of soft materials.

Meguya Ryu¹, Megumi Akoshima¹, Junko Morikawa²

¹National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Umezono, Tsukuba 305-8563, Japan.

The Review of Scientific Instruments

|April 30, 2022

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We developed a microscale method using cantilever thermocouple nanoprobes to measure thermal diffusivity in soft materials. This technique accurately determines thermal properties with minimal error, advancing material science research.

Area of Science:

Materials Science
Nanotechnology
Thermal Physics

Background:

Measuring thermal properties of soft materials at the microscale presents significant challenges.
Existing methods often lack the precision required for microscale analysis.

Purpose of the Study:

To develop a novel method and apparatus for measuring the thermal diffusivity of soft materials on a microscale.
To establish a precise contact positioning technique for nanoprobes on sample surfaces.

Main Methods:

Utilized the periodic heating method with cantilever thermocouple nanoprobes.
Defined probe-sample contact position by monitoring the DC component of thermal electromotive force (EMF).
Measured phase shift of the AC component of thermal EMF to determine thermal diffusivity.

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Thermal Measurement Techniques in Analytical Microfluidic Devices

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Published on: June 3, 2015

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Main Results:

Successfully developed a method and apparatus for microscale thermal diffusivity measurement.
Achieved accurate determination of thermal diffusivity for microstructured photoresist with a ±3% deviation.
Established a reliable surface reference position by minimizing thermal contact conductance variations.

Conclusions:

The developed method provides accurate microscale thermal diffusivity measurements for soft materials.
The technique's precision in contact positioning enhances reliability in nanoscale thermal analysis.
This advancement offers a valuable tool for characterizing microscale thermal transport in soft matter.