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Updated: Sep 25, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Study on curing kinetics and behaviours of PGN adhesives
Tengbo Li1, Xiaomeng Li1, Shanjun Ding2
1School of Materials Science and Engineering, Beijing Institute of Technology Beijing 100081 China 13651278705@139.com.
Abstract:
The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.
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