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Published on: November 7, 2017
Domain Wall Automotion in Three-Dimensional Magnetic Helical Interconnectors
Luka Skoric1, Claire Donnelly1,2, Aurelio Hierro-Rodriguez3,4
1Department of Physics, Cavendish Laboratory, University of Cambridge, JJ Thomson Ave, Cambridge CB3 0HE, United Kingdom.
Researchers developed a 3D magnetic interconnector using helical conduits to transfer magnetic information. This device utilizes geometry-driven domain wall (DW) automotion, overcoming limitations of current CMOS technologies for future computing.
Area of Science:
- Spintronics and Nanotechnology
- Materials Science and Engineering
Background:
- Traditional CMOS technology faces fundamental limits in information processing.
- Novel approaches for information storage, computation, and transmission are crucial.
- Exploring beyond CMOS requires innovative materials and device architectures.
Purpose of the Study:
- To propose and prototype a 3D magnetic interconnector for efficient information transfer.
- To investigate the mechanism of geometry-driven automotion of magnetic domain walls (DWs) in 3D structures.
- To demonstrate a pathway for magnetic information transfer in three dimensions.
Main Methods:
- Fabrication of 3D helical DW conduits using 3D nanoprinting and physical vapor deposition.
- Experimental observation of DW automotion using X-ray microscopy under varying magnetic fields.
- Micromagnetic simulations to analyze DW motion mechanisms and energy landscapes.
Main Results:
- Observed robust, unidirectional automotion of DWs in 3D helical conduits.
- Identified large thickness gradients as the primary driver for 3D DW automotion.
- Demonstrated tailorable magnetic energy gradients and their competition with pinning effects.
- Predicted high DW velocities approaching the Walker limit.
Conclusions:
- 3D magnetic interconnectors exploiting geometry-driven DW automotion offer a novel approach for information transfer.
- Thickness gradients in 3D nanostructures are key to controlling DW motion.
- This technology shows potential for efficient 3D magnetic information transfer, advancing beyond CMOS limitations.
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