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Updated: Sep 22, 2025

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

Circuit-Level Memory Technologies and Applications based on 2D Materials.

Jiahui Ma¹, Hefei Liu¹, Ning Yang²

¹Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, CA, 90089, USA.

Advanced Materials (Deerfield Beach, Fla.)

|May 24, 2022

Summary

This summary is machine-generated.

Emerging 2D materials offer advanced memory technologies for highly integrated circuits. This review covers their fabrication, circuit integration, and potential for in-memory computing applications.

Keywords:

2D materials in-memory computing integrated circuits memory technology

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Area of Science:

Materials Science and Engineering
Electrical Engineering
Computer Science

Background:

Growing interest in 2D materials for memory devices due to unique electronic properties.
Potential for enhanced performance, low power consumption, and novel functionalities in integrated circuits.

Purpose of the Study:

To provide a comprehensive overview of 2D-material-based memory technologies and circuit-level applications.
To review fabrication methods, integration strategies, and in-memory computing potential.
To identify challenges and future perspectives for large-scale application.

Main Methods:

Systematic review of literature on 2D material growth and fabrication techniques for memory devices.
Analysis of integrated memory circuits, including conventional and emerging architectures (e.g., memristive crossbars, 3D stacking).
Comparison of experimental and theoretical data for critical device parameters across different integration approaches.

Main Results:

Discussion of advantages and disadvantages of various large-scale fabrication methods for 2D memory devices.
Review of diverse integration schemes, from planar arrays to 3D monolithic structures.
Summary of 2D memory array applications in logic-in-memory and neuromorphic computing.

Conclusions:

2D materials present significant opportunities for next-generation memory and computing.
Challenges in system-level fabrication need to be addressed for widespread adoption.
Future research should focus on reliable and scalable manufacturing processes.