Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Experiment Video

Updated: Sep 21, 2025

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS
08:01

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS

Published on: June 17, 2017

12.4K

Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration".

Seonho Seok1

  • 1Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Orsay, France.

Micromachines
|May 28, 2022
PubMed
Summary

Advancing fabrication technologies drive MEMS packaging development in two key areas: device packaging and system integration. This ensures enhanced performance and miniaturization for microelectromechanical systems.

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

High-Porosity Sieve-Type Neural Electrodes for Motor Function Recovery and Nerve Signal Acquisition.

Micromachines·2024
Same author

Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation.

Micromachines·2024
Same author

FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation.

Micromachines·2023
Same author

Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties.

Micromachines·2023
Same author

Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package.

Micromachines·2022

Area of Science:

  • Engineering
  • Materials Science
  • Nanotechnology

Background:

  • Microelectromechanical systems (MEMS) fabrication technologies are rapidly advancing.
  • Packaging is a critical aspect of MEMS development, influencing performance and reliability.
  • Current trends focus on two primary directions for MEMS packaging.

More Related Videos

Using Micro-Electro-Mechanical Systems MEMS to Develop Diagnostic Tools
16:05

Using Micro-Electro-Mechanical Systems MEMS to Develop Diagnostic Tools

Published on: October 1, 2007

7.6K
High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

7.5K

Related Experiment Videos

Last Updated: Sep 21, 2025

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS
08:01

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS

Published on: June 17, 2017

12.4K
Using Micro-Electro-Mechanical Systems MEMS to Develop Diagnostic Tools
16:05

Using Micro-Electro-Mechanical Systems MEMS to Develop Diagnostic Tools

Published on: October 1, 2007

7.6K
High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

7.5K