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Updated: Sep 21, 2025

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Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS
Published on: June 17, 2017
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Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"
1Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Orsay, France.
Micromachines
|May 28, 2022
Abstract:
As fabrication technologies advance, the packaging of MEMS device is being developed in two main directions: MEMS device packaging and MEMS or sensor system integration [...].

