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Seonho Seok

Showing results (1-10 of 11) with videos related to

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Micromachines|July 29, 2023
FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical SimulationSeonho Seok
Micromachines|May 28, 2022
Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"Seonho Seok
Micromachines|September 28, 2021
Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability SimulationSeonho Seok
Micromachines|June 26, 2020
Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural ProbeSeonho Seok, HyungDal Park, Jinseok Kim
Micromachines|April 27, 2024
Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical SimulationSeonho Seok, HyungDal Park, Jinseok Kim
Micromachines|July 8, 2023
Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material PropertiesSeonho Seok, HyungDal Park, Philippe Coste, et al.
Sensors (Basel, Switzerland)|September 9, 2020
Autonomous Energy Harvester Based on Textile-Based Enzymatic Biofuel Cell for On-Demand UsageSeonho Seok, Cong Wang, Elie Lefeuvre, et al.
Micromachines|August 26, 2022
Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable PackageSeonho Seok, HyungDal Park, Yong-Jun Kim, et al.
Micromachines|April 23, 2022
A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic ImplantationHyungDal Park, Wonsuk Choi, Seonghwan Oh, et al.
Micromachines|July 27, 2024
High-Porosity Sieve-Type Neural Electrodes for Motor Function Recovery and Nerve Signal AcquisitionWonsuk Choi, HyungDal Park, Seonghwan Oh, et al.
Pageof 2

Showing results (1-10 of 11) with videos related to

Sort By:
Pageof 2
Micromachines|July 29, 2023
FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical SimulationSeonho Seok
Micromachines|May 28, 2022
Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"Seonho Seok
Micromachines|September 28, 2021
Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability SimulationSeonho Seok
Micromachines|June 26, 2020
Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural ProbeSeonho Seok, HyungDal Park, Jinseok Kim
Micromachines|April 27, 2024
Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical SimulationSeonho Seok, HyungDal Park, Jinseok Kim
Micromachines|July 8, 2023
Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material PropertiesSeonho Seok, HyungDal Park, Philippe Coste, et al.
Sensors (Basel, Switzerland)|September 9, 2020
Autonomous Energy Harvester Based on Textile-Based Enzymatic Biofuel Cell for On-Demand UsageSeonho Seok, Cong Wang, Elie Lefeuvre, et al.
Micromachines|August 26, 2022
Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable PackageSeonho Seok, HyungDal Park, Yong-Jun Kim, et al.
Micromachines|April 23, 2022
A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic ImplantationHyungDal Park, Wonsuk Choi, Seonghwan Oh, et al.
Micromachines|July 27, 2024
High-Porosity Sieve-Type Neural Electrodes for Motor Function Recovery and Nerve Signal AcquisitionWonsuk Choi, HyungDal Park, Seonghwan Oh, et al.
Pageof 2