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Simple and practical methods for utilizing parylene C film based on vertical deposition and laser patterning
Jee Hoon Sim1, Hyeonwook Chae1, Su-Bon Kim1
1School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-Ro, Yuseong-Gu, Daejeon, 34141, Republic of Korea.
Scientific Reports
|June 10, 2022
Summary
Two new methods enhance parylene C film utilization. A vertical deposition technique ensures uniform thickness on both sides, while laser patterning creates ultrathin, flexible films for advanced devices.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Parylene C films are valuable for microelectronics and biomedical applications.
- Uniform thickness and precise patterning of parylene C are critical for device performance.
- Existing fabrication methods can be complex and time-consuming.
Purpose of the Study:
- To develop novel, efficient methods for parylene C film deposition and patterning.
- To enable the fabrication of high-quality, ultrathin, and flexible parylene C films.
- To demonstrate the utility of these methods in creating advanced electronic devices.
Main Methods:
- Vertical deposition for uniform, double-sided parylene C film coating.
- Mask-less laser patterning for debris-tolerant fabrication of self-supporting films.
- Fabrication of flexible, stretchable, and waterproof bifacial blue LED modules.
Main Results:
- Achieved 4 μm parylene C films with <2.5% thickness deviation on both sides.
- Demonstrated uniform thickness distribution and high surface uniformity.
- Created patterned films with diverse geometric shapes for flexible device substrates.
- Successfully fabricated waterproof-packaged bifacial blue LED modules.
Conclusions:
- The proposed vertical deposition and laser patterning methods offer effective utilization of parylene C films.
- These techniques facilitate the creation of highly flexible, stretchable, and biocompatible electronic devices.
- The developed methods show significant potential for emerging applications requiring versatile form factors.
