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Related Concept Videos

Strain and Elastic Modulus01:15

Strain and Elastic Modulus

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The quantity that describes the deformation of a body under stress is known as strain. Strain is given as a fractional change in either length, volume, or geometry under tensile, volume (also known as bulk), or shear stress, respectively, and is a dimensionless quantity. The strain experienced by a body under tensile or compressive stress is called tensile or compressive strain, respectively. In contrast, the strain experienced under bulk stress and shear stress is known as volume and shear...
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A material's elastic behavior is characterized by the disappearance of stress once the load is removed, allowing the material to return to its original state. However, when stress surpasses the yield point, yielding commences, marking the onset of plastic deformation or permanent set. This change from elastic to plastic behavior is influenced by the peak stress value and the duration before the load is removed. An intriguing observation occurs when a specimen is loaded, unloaded, and...
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As discussed in previous lessons, strain energy in a material is the energy stored when it is elastically deformed, a concept crucial in materials science and mechanical engineering. This energy results from the internal work done against the cohesive forces within the material. When a material undergoes shearing stress and corresponding shearing strain, the strain energy density, which is the energy stored per unit volume, is calculated. Within the elastic limit, where the stress is...
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Recent progress in strain-engineered elastic platforms for stretchable thin-film devices.

Hyeon Cho1, Byeongmoon Lee2, Dongju Jang1

  • 1Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea. yongtaek@snu.ac.kr.

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Summary
This summary is machine-generated.

Strain engineering enables elastic platforms for advanced stretchable electronics. These platforms improve device performance and reliability for human-machine interfaces.

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Electrical Engineering

Background:

  • Stretchable electronic systems require platforms that manage mechanical stress.
  • Strain engineering offers adjustable mechanical compliance for these systems.
  • Recent advancements focus on integrating thin-film devices onto elastic platforms.

Purpose of the Study:

  • To review recent developments in strain-engineered elastic platforms.
  • To highlight enabling technologies for stretchable substrates and interconnects.
  • To present applications and future challenges in stretchable electronics.

Main Methods:

  • Exploiting strain-free regions for device fabrication.
  • Utilizing stretchable conductors in island-bridge configurations.
  • Analyzing material homogeneity and structural design of substrates.

Main Results:

  • Demonstrated multifunctional stretchable thin-film devices with superior performance.
  • Showcased applications in sensors, energy devices, transistors, and displays.
  • Introduced approaches for strain-engineered substrates and interconnects.

Conclusions:

  • Strain-engineered elastic platforms are crucial for reliable stretchable electronics.
  • These platforms enable advanced human-machine interfaces.
  • Further research is needed to address existing challenges and unlock future potential.