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A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly.

Lingyao Sun1, Zhenhua Guo1, Xiuchen Zhao1

  • 1School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China.

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|June 24, 2022
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Summary

This study presents a low-temperature assembly method using a novel solder paste, achieving excellent wetting and shear strength. This technique offers a promising alternative for advanced packaging, reducing lead content and improving durability compared to traditional Sn58Bi solder.

Keywords:
3D ICBi aggregationSn-Bi solderlow-temperature soldering

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Area of Science:

  • Materials Science
  • Metallurgy
  • Electronics Manufacturing

Background:

  • Traditional soldering methods often require high temperatures, limiting their application in sensitive electronic components.
  • Lead-free solders like eutectic Sn-Bi present challenges in terms of interfacial stability and long-term reliability.
  • Advanced packaging technologies demand materials that enable low-temperature processing and enhanced durability.

Purpose of the Study:

  • To develop and evaluate a low-temperature solder assembly technique using a quaternary eutectic solder paste.
  • To assess the interfacial properties, wetting behavior, and shear strength of the novel solder joint.
  • To compare the performance and reliability of the new assembly method against conventional Sn-Bi solder.

Main Methods:

  • Reflowing a quaternary eutectic solder paste (13.5Sn-37.5Bi-45In-4Pb) with SAC 305 solder balls at 140 °C for 5 minutes.
  • Measuring the wetting angle of the resultant solder joints.
  • Analyzing the lead content and shear strength of the solder joints after aging at 80 °C for 25 days.
  • Observing interfacial phenomena, specifically Bi phase segregation.

Main Results:

  • Successful low-temperature assembly achieved at 140 °C.
  • The mixed solder joint exhibited a favorable wetting angle of 17.55°.
  • Lead content in the final solder joint was reduced to less than 1%.
  • The assembly showed no significant decrease in shear strength after aging, outperforming Sn58Bi solder.
  • Bi phase segregation at the interface was observed to be slower compared to Sn-Bi solder joints.

Conclusions:

  • The developed low-temperature assembly technique is effective and reliable.
  • This method offers advantages over Sn-Bi solder, including reduced lead content and improved aging stability.
  • The technique shows significant promise for application in advanced packaging, potentially replacing eutectic Sn-Bi solder.