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Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders.
Xiaochen Xie1,2, Pengrong Lin2,3, Binhao Lian2
1School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China.
Materials (Basel, Switzerland)
|February 26, 2025
Summary
This study introduces indium (In) into tin-lead (SnPb) eutectic solder, creating a new low-temperature solder for 3D packaging. The SnPbIn solder exhibits reduced melting points and enhanced super-plasticity, meeting advanced packaging demands.
Area of Science:
- Materials Science
- Metallurgy
- Electronics Packaging
Background:
- Traditional solders face limitations in advanced 3D packaging due to high melting points.
- Developing low-temperature solders is crucial for enabling complex microelectronic assembly.
Purpose of the Study:
- To investigate the effects of indium (In) addition on the properties of tin-lead (SnPb) eutectic solder.
- To develop a novel low-temperature solder suitable for 3D packaging applications.
Main Methods:
- SnPbIn solders with varying In content (5-17 wt.%) were fabricated using vacuum induction melting.
- Microstructural analysis, melting point determination, and mechanical property testing (tensile strength, elongation) were performed.
Main Results:
- Indium addition above 5 wt.% introduced a new InSn4 phase and reduced melting points, with Sn-Pb-13In reaching 150.5 °C.
- Cast Sn-Pb-5In showed optimal tensile strength (48.8 MPa) and elongation (27.3%).
- Cold-rolled SnPbIn exhibited super-plasticity, with 59.9Sn35.1Pb5In achieving over 380% elongation.
Conclusions:
- Indium addition effectively lowers the melting point of SnPb solder, making it suitable for 3D packaging.
- The SnPbIn system demonstrates potential for high-ductility applications due to super-plasticity, attributed to recrystallization and soft orientation.
