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Published on: April 10, 2017
Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced
Pengrong Lin1,2, Zirui Tong3, Shimeng Xu1,2
1Beijing Microelectronics Technology Institute, Beijing 100076, China.
Materials (Basel, Switzerland)
|June 12, 2026
Summary
Submicron triangular silver flake paste offers improved sintering for electronic packaging. This novel material achieves high joint strength and thermal conductivity at low temperatures, overcoming limitations of traditional spherical silver particles.
Area of Science:
- Materials Science
- Nanotechnology
- Electronics Engineering
Background:
- Silver pastes are crucial for advanced electronic packaging, enabling low-temperature joining and high-temperature stability.
- Spherical silver particles exhibit limitations in sintering efficiency and high porosity due to restricted contact areas.
Purpose of the Study:
- To investigate submicron triangular silver flake paste as a superior alternative to spherical silver particles.
- To enhance sintering efficiency, reduce porosity, and improve joint strength in electronic packaging applications.
Main Methods:
- Utilized submicron triangular silver flake paste for joining applications.
- Employed pressureless sintering at 250 °C.
- Analyzed joint strength, porosity, and thermal conductivity of the sintered joints.
Main Results:
- Achieved a high joint strength of 35.2 MPa.
- Obtained a low porosity of 9.48%.
- Recorded a thermal conductivity of 134.9 W/(m·K).
Conclusions:
- Submicron triangular silver flake paste demonstrates significantly enhanced sintering performance.
- The unique sintering mechanism contributes to superior mechanical and thermal properties.
- This material is a viable high-performance bonding solution for advanced electronic packaging.
