Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and

Jun Liu1,2, Shanhong Xia1,2, Chunrong Peng1

  • 1State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.

Micromachines
|June 24, 2022
PubMed
Summary

This study introduces a novel wafer-level vacuum-packaged electric field microsensor (EFM) with high performance and low power. The innovative design utilizes a silicon-on-insulator conductive handle layer for efficient electric field sensing.

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