Effect of light-curing time and direction on microhardness of a light-cured resin composite to cement CAD-CAM...

To evaluate the effect of light-curing exposure time and location on polymerization of a restorative bulk-fill resin composite to lute endocrowns.

A light-cured restorative bulk-fill resin composite (Filtek One Bulk Fill) was submitted to direct light-curing by a high-power LED light-curing unit for 20 seconds as the positive control group (n= 10). Five more groups (n= 10) were light-cured in a natural tooth mold from two sites (labial and lingual) through a nanohybrid resin composite CAD-CAM restoration (Lava Ultimate A2 LT), for different irradiation times: 90 seconds per site, 40 seconds per site, 30 seconds per site, 20 seconds per site and 10 seconds per site. Vickers microhardness measurements were made at two different depths and test/control ratios were calculated. Ratios of 0.8 were considered as an adequate level of curing. A quantile regression was run to identify the minimally sufficient time of light-curing, and a two-way ANOVA was used to compare the results to previous findings and evaluate the effect of curing location.

Analysis showed that 40 seconds x 2 is the minimal irradiation time that presents a test/control ratio above 0.8. Quantile regressions showed that the required irradiation time to reach a test/control ratio of 0.8 at a confidence level of 95% is 41.5 seconds and 39.2 seconds at 200 µm and 500 µm depths in the luting agent, respectively. There was no statistically significant difference between microhardness of the two depths except for the irradiation time of 10 seconds. The two-site to three-site light curing comparison showed no statistically significant difference except for the 90-second time.

Systematic light-curing through the labial, lingual and occlusal surfaces of thick indirect restorations is not always required for sufficient polymerization and can even waste valuable clinical time especially in the case of multiple restorations luted with resin composites.