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Intrinsic parameter-free calibration of FPP using a ray phase mapping model.

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    |July 15, 2022
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    Summary
    This summary is machine-generated.

    A new ray phase mapping model (RPM) simplifies 3D surface reconstruction in fringe projection profilometry (FPP) by eliminating intrinsic parameter calibration. This method offers accurate 3D mapping for various FPP systems.

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    Area of Science:

    • Optical Engineering
    • 3D Metrology
    • Computer Vision

    Background:

    • Fringe Projection Profilometry (FPP) is a key technique for 3D surface reconstruction.
    • Traditional FPP methods require complex calibration of intrinsic camera parameters, including lens distortion.
    • These calibration steps can be time-consuming and system-specific.

    Purpose of the Study:

    • To introduce a novel Ray Phase Mapping (RPM) model for FPP.
    • To eliminate the need for intrinsic parameter calibration in FPP systems.
    • To develop a universal and accurate method for 3D mapping across different FPP configurations.

    Main Methods:

    • The proposed Ray Phase Mapping (RPM) model characterizes the imaging system using independent rays for each pixel.
    • It associates these rays with the projected phase in the illumination field for efficient 3D mapping.
    • Two distinct loss functions are employed to optimize camera ray parameters and mapping coefficients.

    Main Results:

    • The RPM model successfully avoids complex, imaging-specific modeling of lens layout and distortion.
    • Experiments demonstrate high accuracy in 3D mapping for wide-angle lens FPP, telecentric lens FPP, and MEMS-based FPP systems.
    • The method proves feasible and effective across diverse FPP hardware.

    Conclusions:

    • The Ray Phase Mapping (RPM) model offers a simplified and accurate approach to 3D reconstruction in FPP.
    • Its ability to bypass intrinsic parameter calibration makes it a versatile solution for various FPP systems.
    • This universal approach has significant potential for advancing 3D metrology applications.