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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint

Sinan Zhang1, Zhen Wang2, Jie Wang3

  • 1School of Physical Science and Technology, Lanzhou University, Lanzhou 730000, China.

Materials (Basel, Switzerland)
|July 27, 2022
PubMed

Keywords:
Cu/SAC305/Cu solder jointsFE simulationX-ray μ-CTfracture analysisin situ tensile test

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