Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging.

Area of Science:

• Materials Science
• Nanotechnology
• Thermal Engineering

Background:

• Miniaturized 3D electronic devices require efficient thermal management due to high power density.
• Current thermal interface materials (TIMs) face limitations in thermal conductivity and heat-directing capabilities.
• Effective heat dissipation in electrically insulating packaging is crucial for device reliability.

Purpose of the Study:

• To create high thermal conductivity boron nitride (BN)-based composites for advanced thermal management.
• To develop a method for intentionally directing heat dissipation in electrically insulating packaging.
• To address the thermal challenges posed by high-power-density 3D electronic devices.

Main Methods:

• Magnetically assisted slip casting was employed to create BN-based composites.
• Magnetic functionalization of BN microplatelets enabled controlled, localized orientation.
• Microstructure design focused on achieving high BN concentration and alignment for enhanced thermal conductivity.

Main Results:

• Achieved unusually high thermal conductivity up to 12.1 W m⁻¹ K⁻¹ along the alignment direction.
• Composites contained a high concentration of BN (62.6 vol%) with low polymeric binder.
• Demonstrated proof-of-concept composites with locally graded BN orientations for strategic heat redirection from stacked heat sources.

Conclusions:

• The developed BN composites offer superior thermal conductivity and directional heat dissipation capabilities.
• Magnetically assisted slip casting provides precise control over microplatelet orientation for tailored thermal management.
• This approach presents a promising solution for efficient thermal management in 3D integrated electronics.