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Updated: Sep 1, 2025

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Cross-Linking Network of Soft-Rigid Dual Chains to Effectively Suppress Volume Change of Silicon Anode
Jie Liu1, Ruguang Ma2, Wei Zheng1
1The State Key Laboratory of High-Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China.
Abstract:
Polyacrylic acid (PAA) is a promising binder for the high-capacity Si anode. However, the one-dimensional structure of PAA could cause the linear molecular chains to slide from the Si surface during the charge-discharge processes, leading to insufficient suppression of the massive volume expansion of the Si anode. Herein, a soft-rigid dual chains' network of PAA-sodium silicate (PAA-SS) was successfully constructed by cross-linking PAA and SS in situ at room temperature. The soft chains of PAA and the rigid chains of polysilicic acid synergistically ensure the enhanced adhesion property and mechanical strength. Therefore, the Si electrode with PAA-SS binder delivers a discharge capacity of 1559 mAh/g after 150 cycles at 4.2 A/g (1C) with an initial Coulombic efficiency of 93.2%. Moreover, the PAA-SS based SiC-500 electrode exhibits a discharge capacity of 441 mAh/g with the capacity retention of 88.2% after 500 cycles at 0.5 A/g, implying the PAA-SS binder's great industrial prospect in Si based electrodes.
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