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Updated: Aug 30, 2025

08:05
Localized Bathless Metal-Composite Plating via Electrostamping
Published on: September 22, 2020
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Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films
Jessica R Wagner1, Jared Fletcher1, Stephen A Morin1,2,3
1Department of Chemistry, University of Nebraska-Lincoln, Hamilton Hall, Lincoln, NE 68588, USA. smorin2@unl.edu.
Abstract:
A general approach to increase the adhesion of metal films to commodity plastic substrates using a metal-chelating polymer, polyethyleneimine, in conjunction with patterned electroless deposition is described. This general fabrication method is compatible with a diverse array of plastics and metals with properties applicable to flexible electronic circuits and electrochemical cells.

