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Treating Knock-On Displacements in Fluctuation Electron Microscopy Experiments.

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Summary
This summary is machine-generated.

Knock-on displacements in amorphous silicon affect fluctuation electron microscopy (FEM) data. Lowering electron dose or accelerating voltage minimizes these effects for improved experimental results.

Keywords:
amorphous siliconbeam damagediffraction mappingfluctuation electron microscopymedium-range order

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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Electron Microscopy

Background:

  • Fluctuation electron microscopy (FEM) is sensitive to sample structure.
  • Beam-induced atomic displacements can alter experimental results.
  • Amorphous silicon is a model system for studying radiation effects.

Purpose of the Study:

  • Investigate the influence of knock-on displacements on FEM experiments.
  • Determine optimal experimental parameters to mitigate these effects.
  • Evaluate the impact of different cameras and energy filtering.

Main Methods:

  • Conducted FEM experiments on amorphous silicon using a transmission electron microscope.
  • Varied acceleration voltage (300 kV vs. 60 kV), electron dose, binning, and camera type (CCD vs. CMOS).
  • Utilized energy filtering to assess its effect on data quality.

Main Results:

  • Energy filtering significantly improved speckle contrast by removing inelastic background.
  • CMOS cameras showed slightly higher normalized variance but were more susceptible to noise at low counts.
  • Beam-induced displacements suppressed normalized variance at 300 kV with increasing dose.
  • Displacements were reduced at 60 kV due to energy transfer below the displacement threshold.

Conclusions:

  • Knock-on displacements negatively impact FEM data quality at higher voltages.
  • Minimizing electron dose and using lower acceleration voltages (60 kV) are effective strategies to control variance suppression.
  • Experimental parameters must be carefully chosen to avoid beam-induced artifacts in FEM studies.