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Design and implementation of sequential excitation module for high fidelity piezoresponse force microscopy
Chunlin Song1, Boyuan Huang1, Jun Feng1
1Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, Guangdong, China and Guangdong Provincial Key Laboratory of Functional Oxide Materials and Devices, Southern University of Science and Technology, Shenzhen 518055, Guangdong, China.
This study introduces a sequential excitation (SE) module for high-fidelity piezoresponse force microscopy (PFM). This innovation overcomes challenges in tracking resonance frequency shifts, enabling reliable mapping of weak electromechanical effects.
Area of Science:
- Materials Science
- Nanotechnology
- Physics
Background:
- Accurate mapping of weak electromechanical effects using piezoresponse force microscopy (PFM) relies on contact resonance mode.
- Significant variations in sample contact stiffness pose challenges for tracking resonance frequency shifts in PFM.
Purpose of the Study:
- To develop a high-fidelity PFM method that overcomes limitations in resonance frequency tracking.
- To enable reliable characterization of materials with varying contact stiffness.
Main Methods:
- Developed a sequential excitation (SE) module utilizing a discrete frequency sweep signal, eliminating the need for resonance frequency tracking.
- Employed an oscilloscope for sampling the AC component of piezoresponse, replacing traditional lock-in amplifiers.
- Implemented a fast on-the-fly data analysis method for efficient cantilever transfer function fitting.
Main Results:
- Demonstrated the capability of the SE module on a PMN-PT film using first and second harmonic PFM.
- Successfully probed a suspended freestanding MoS2 membrane, a material with substantial contact stiffness variations.
- Achieved high-fidelity PFM measurements despite significant changes in contact stiffness.
Conclusions:
- The developed SE module enhances the reliability and fidelity of PFM measurements.
- This method is effective for characterizing materials with challenging, variable contact stiffness.
- The approach facilitates accurate mapping of weak electromechanical effects in diverse material systems.

