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Updated: Aug 29, 2025

Plasma-assisted Molecular Beam Epitaxy of N-polar InAlN-barrier High-electron-mobility Transistors
Published on: November 24, 2016
Influence of a Two-Dimensional Growth Mode on Electrical Properties of the GaN Buffer in an AlGaN/GaN High Electron
Volkan Esendag1, Peng Feng1, Chenqi Zhu1
1Department of Electrical and Electronic Engineering, The University of Sheffield, Mappin Street, Sheffield S1 3JD, UK.
Abstract:
An extensive study has been conducted on a series of AlGaN/GaN high electron mobility transistor (HEMT) samples using metalorganic vapour phase epitaxy, to investigate the influence of growth modes for GaN buffer layers on device performance. The unintentional doping concentration and screw dislocation density are significantly lower in the samples grown with our special two-dimensional (2D) growth approach, compared to a widely-used two-step method combining the 2D and 3D growth. The GaN buffer layers grown by the 2D growth approach have achieved an unintentional doping density of 2 × 1014 cm-3, two orders lower than 1016 cm-3 of the GaN samples grown using a conventional two-step method. High-frequency capacitance measurements show that the samples with lower unintentional doping densities have lower buffer leakage and higher breakdown limits. This series of samples have attained sub-nA/mm leakages, a high breakdown limit of 2.5 MV/cm, and a saturation current density of about 1.1 A/mm. It indicates that our special 2D growth approach can effectively lessen the unintentional doping in GaN buffer layers, leading to low buffer leakage and high breakdown limits of GaN/AlGaN HEMTs.
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