Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with...

In this study, power/ground noise suppression structures were designed based on a proposed dispersion analysis for packages and interposers with low-loss substrates. Low-loss substrates are suitable for maintaining signal integrity (SI) of high-speed channels operating at high data rates. However, when the power/ground noise is generated in the power delivery network (PDN), low-loss substrates cannot suppress the power/ground noise, thereby causing PDN-induced crosstalk and various power integrity (PI) issues. To solve these issues, noise suppression structures generating electromagnetic bandgap were proposed and designed. The mechanism of the proposed structures was examined based on a proposed dispersion analysis. The proposed structures were designed and fabricated in glass interposer test vehicles, and the effectiveness of the structures on power/ground noise suppression was experimentally validated by measuring the noise suppression band. The proposed dispersion analysis was also verified by comparing the derived noise stopband edges (fL and fU) with electromagnetic (EM) simulation and experimental results, and they all showed good agreement. Compared to EM simulation, the proposed method required smaller computational resources but showed good accuracy. Using the proposed dispersion analysis, various power/ground noise suppression bands were designed considering the applications and design rules of packages and interposers. With measurements and EM/circuit simulations, the effectiveness of the designed structure in maintaining SI/PI was verified. By adopting the designed structures, the noise transfer properties in the PDN were suppressed in the target suppression frequency band, which is key for PI design. Finally, it was verified that the proposed structures were capable of suppressing power/ground noise propagation in the PDN by analyzing PDN-induced crosstalk in the high-speed channel.