Electrical Performance Analysis of High-Speed Interconnection and Power Delivery Network (PDN) in Low-Loss Glass...

Area of Science:

• Electrical Engineering
• Materials Science
• Semiconductor Device Physics

Background:

• Low-loss glass substrates are emerging as a superior alternative to silicon for high-speed interposers due to enhanced signaling and fabrication yield.
• The inherent low-loss property of glass, while beneficial for signal integrity (SI), presents challenges in suppressing power delivery network (PDN) noise.
• Effective management of SI and PI is critical for realizing the full potential of glass interposers in advanced electronic packaging.

Purpose of the Study:

• To conduct a comprehensive electrical performance analysis of high-speed interconnections and PDN in low-loss glass substrate-based interposers.
• To compare the SI and PI performance of glass interposers against silicon and organic counterparts.
• To investigate and propose solutions for mitigating power/ground noise in glass interposer PDNs.

Main Methods:

• Fabrication of test vehicles for glass interposers and comparative analysis.
• Electromagnetic (EM) and circuit simulations to evaluate insertion loss, eye diagrams, and signal bandwidth.
• Measurement and comparison of through-glass via (TGV) performance against through-silicon via (TSV).
• Analysis of various noise-inducing scenarios in the PDN through simulation and measurement.

Main Results:

• Glass interposers demonstrate superior high-speed interconnection performance, including lower insertion loss and wider signal bandwidth, compared to silicon and organic interposers.
• Through-glass via (TGV) channels exhibit competitive or better electrical performance than through-silicon via (TSV) channels.
• Identified critical power/ground noise issues in glass interposer PDNs that require specific design considerations.

Conclusions:

• Low-loss glass interposers are highly suitable for maintaining signal integrity in high-speed applications.
• Addressing power delivery network noise is essential for robust performance, necessitating advanced design techniques.
• Proposed ground TGV and electromagnetic bandgap (EBG) designs offer effective broadband noise suppression for glass interposer PDNs.