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Related Concept Videos

Inductively Coupled Plasma Atomic Emission Spectroscopy: Principle01:19

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Inductively coupled plasma (ICP) is the most widely used plasma source in atomic emission spectroscopy (AES), also known as Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES). The ICP source, or torch, consists of three concentric quartz tubes with argon gas flowing through them. A spark from a Tesla coil initiates the ionization of argon, generating a high-temperature plasma.
The ions and electrons produced interact with the fluctuating magnetic field created by a water-cooled...
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High-Efficiency Copper Removal by Nitrogen Plasma-Assisted Picosecond Laser Processing.

Yunfan Li1, Xuanqi Guo1, Shuai Wang2

  • 1School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China.

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|September 23, 2022
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Summary

Nitrogen plasma significantly enhances copper removal efficiency during picosecond laser ablation. This plasma-assisted process improves both precision and speed, showing great potential for electronic device manufacturing.

Keywords:
Cu removalhigh-efficiencynitrogen plasmaps-laser

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Area of Science:

  • Materials Science
  • Surface Engineering
  • Laser Physics

Background:

  • Efficient copper (Cu) removal is critical for processing Cu-based electronic devices.
  • Current laser ablation methods face challenges in optimizing removal efficiency and precision.

Purpose of the Study:

  • To investigate the effectiveness of a nitrogen plasma-assisted picosecond (ps) laser process for enhancing Cu removal.
  • To analyze the interaction mechanism and optimize processing parameters for improved Cu ablation.

Main Methods:

  • Utilized nitrogen plasma in conjunction with ps-laser ablation for Cu film removal.
  • Employed the dual temperature model (TTM) and finite element analysis (FEA) for theoretical investigation.
  • Experimentally analyzed the effect of plasma flow angle on Cu laser ablation.

Main Results:

  • Nitrogen plasma cleaning and activation significantly improved Cu removal efficiency.
  • Plasma flow angle critically influences ablation: small angles enhance precision, large angles boost efficiency.
  • At 2.69 J/cm², a 30° plasma-assisted ps-laser achieved 148% greater removal depth than non-assisted ablation.

Conclusions:

  • Nitrogen plasma-assisted ps-laser ablation offers a substantial improvement in Cu removal efficiency.
  • Optimizing plasma flow angle allows for tailored processing, balancing precision and speed.
  • This technique demonstrates significant application potential for advanced electronic device fabrication.