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Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal
Yongxin Qian1, Yubo Luo1, Abubakar Yakubu Haruna1
1State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China.
Small (Weinheim an Der Bergstrasse, Germany)
|October 13, 2022
Summary
This study developed a novel epoxy composite for advanced electronics. The material offers superior electromagnetic wave absorption, thermal conductivity, and flame retardancy, overcoming key challenges in electronic packaging.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Integrated circuits face electromagnetic interference and heat issues in polymer packaging.
- Next-generation electronics require advanced materials for reliable performance.
Purpose of the Study:
- To develop a multifunctional epoxy-based composite (MDCF@LDH/EP).
- To enhance electromagnetic wave absorption, thermal conductivity, and flame retardancy for electronic packaging.
Main Methods:
- Synergistic effect of porous structure and heterointerface for electromagnetic wave absorption.
- Incorporation of 3D melamine-derived carbon foams (MDCF) for thermal conductivity.
- Utilizing MDCF@LDH and NiAl-LDH-CO3^2- for thermal stability and flame retardancy.
Main Results:
- Achieved low reflection loss (-57.77 dB) and wide absorption bandwidth (7.20 GHz) with 10 wt% filling.
- Enhanced thermal conductivity of epoxy resin by 241.4% using MDCF.
- Reduced peak heat release rate by 19.4% and total heat release rate by 30.7%.
Conclusions:
- The multifunctional composite (MDCF@LDH/EP) demonstrates excellent electromagnetic wave absorption, thermal conductivity, and flame retardancy.
- The material shows significant potential as a high-performance electronic packaging material.
- Synergistic effects in the composite design are key to its enhanced properties.
