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Updated: Aug 25, 2025

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Chen Li1,2,3, Zhihong Fang1,2, Boshan Sun2,3
1Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan, China.
This study presents a novel method for creating high-temperature vacuum-sealed cavities using silicon nitride (Si3N4) ceramic and advanced brazing techniques. The developed sealed cavities demonstrate excellent bonding strength and stability in extreme thermal conditions.
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08:42High-Sensitivity Nuclear Magnetic Resonance at Giga-Pascal Pressures: A New Tool for Probing Electronic and Chemical Properties of Condensed Matter under Extreme Conditions
Published on: October 10, 2014
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