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Large Dense Periodic Arrays of Vertically Aligned Sharp Silicon Nanocones.

Dirk Jonker1,2, Erwin J W Berenschot3, Niels R Tas3

  • 1Mesoscale Chemical Systems, University of Twente, MESA+ Institute, P.O. Box 217, 7500 AE, Enschede, The Netherlands. d.jonker@utwente.nl.

Nanoscale Research Letters
|October 16, 2022
PubMed
Summary

Researchers developed a novel method to create high-density silicon nanocones using ion beam etching and thermal oxidation. This technique produces precisely shaped, vertically aligned nanocones at wafer scale for advanced applications.

Keywords:
Ion beam etchingNanowiresPeriodic silicon nanoconeSelf-limited oxide growthThermal oxidationVertical alignment

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Semiconductor Physics

Background:

  • Silicon nanocones are crucial for photovoltaics, nanofluidics, nanophotonics, and nanoelectronics.
  • Fabrication of high-quality silicon nanocones requires advanced techniques.

Purpose of the Study:

  • To present a novel wafer-scale fabrication method for high-density, high-aspect-ratio silicon nanocones.
  • To achieve unprecedented homogeneity and precisely controlled apex radii for silicon nanocones.

Main Methods:

  • Utilizing a top-down approach combining argon ion beam etching for pre-shaping silicon nanowires.
  • Employing self-limited thermal oxidation for sharpening the pre-shaped nanowires into nanocones.
  • Organizing nanocones in a square periodic lattice with 250 nm pitch.

Main Results:

  • Fabrication of wafer-scale, vertically aligned, single-crystalline silicon nanocones with high density (1.6 billion/cm²).
  • Achieved apex radii of curvature below 3 nm and minimal height variation (<5 nm for adjacent nanocones).
  • Demonstrated unprecedented homogeneity across millimeter-scale arrays and wafer scale (<80 nm inhomogeneity).

Conclusions:

  • The combined ion beam etching and thermal oxidation method offers precise control over silicon nanocone morphology.
  • The method's applicability extends to other silicon micro- and nanowire fabrication processes.
  • The high homogeneity and precise structure enable advanced applications in nano-scale device modeling and experimentation.