Electrically Conductive Adhesive Based on Thermoplastic Hot Melt Copolyamide and Multi-Walled Carbon Nanotubes

For the bonding of the lightweight composite parts, it is desired to apply electrically conductive adhesive to maintain the ability to shield electromagnetic interference. Among various solvent-based adhesives, there is a new group of thermoplastic hot melt adhesives that are easy to use, solidify quickly, and are environment-friendly. To make them electrically conductive, a copolyamide-based hot melt adhesive was mixed with 5 and 10 wt% of carbon nanotubes using a melt-blending process. Well-dispersed nanotubes, observed by a high-resolution scanning microscope, led to the formation of a percolated network at both concentrations. It resulted in the electrical conductivity of 3.38 S/m achieved for 10 wt% with a bonding strength of 4.8 MPa examined by a lap shear test. Compared to neat copolyamide, Young's modulus increased up to 0.6 GPa and tensile strength up to 30.4 MPa. The carbon nanotubes improved the thermal stability of 20 °C and shifted the glass transition of 10 °C to a higher value. The very low viscosity of the neat adhesive increased about 5-6 orders of magnitude at both concentrations, even at elevated temperatures. With a simultaneous growth in storage and loss modulus this indicates the strong interactions between polymer and carbon nanotubes.