Transfer printing technologies for soft electronics
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Published on: April 6, 2020
Zhenlong Huang1,2,3,4, Yuan Lin1,2,3
1School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China. zhenlong@uestc.edu.cn.
Abstract:
Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.
