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Published on: May 13, 2020
Low-power multilevel resistive switching inβ-Ga2O3based RRAM devices
Ravi Teja Velpula1, Barsha Jain1, Hieu Pham Trung Nguyen1
1Department of Electrical and Computer Engineering, New Jersey Institute of Technology, 323 Dr Martin Luther King Jr Boulevard, Newark, NJ, 07102, United States of America.
Abstract:
In this study, multilevel switching at low-power in Ti/TiN/Ga2O3/Ti/Pt resistive random-access memory (RRAM) devices has been systematically studied. The fabricated RRAM device exhibits an excellent non-overlapping window between set and reset voltages of ∼1.1 V with a maximumRoff/Ronratio of ∼103. Moreover, to the best of our knowledge, the multi-bit storage capability of these RRAM devices with a reasonably highRoff/Ronratio is experimentally demonstrated, for the first time, for lower compliance currents at 10μA, 20μA and 50μA. The multi-bit resistive switching behavior of the Ga2O3RRAM device at a low compliance current paves the way for low-power and high-density data storage applications.
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