Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Experiment Video

Updated: Aug 18, 2025

Planar and Three-Dimensional Printing of Conductive Inks
10:49

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

37.3K

Copper laser patterning on a flexible substrate using a cost-effective 3D printer.

Sajal Chakraborty1, Ho-Yeol Park1, Sung Il Ahn2

  • 1Department of Chemistry Education, Graduate Department of Chemical Materials, Institute for Plastic Information and Energy Materials, Pusan National University, Busandaehakro 63-2, Busan, 46241, Republic of Korea.

Scientific Reports
|December 8, 2022
PubMed
Summary
This summary is machine-generated.

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Unveiling the Trigger Role of Laser Reflections in Laser Direct Patterning of Copper.

ACS applied materials & interfaces·2025
Same author

Design of a heteroleptic green Ir(iii) complex for eco-friendly solution-processed phosphorescent organic light-emitting diodes with external quantum efficiency exceeding 22.

RSC advances·2025
Same author

Nonhalogenated Solvent-Processed Efficient Ternary All-Polymer Solar Cells Enabled by the Introduction of a Naphthyloxy Group into the Side Chain of Polymer Donors.

ACS applied materials & interfaces·2024
Same author

Accomplishing High-Performance Organic Solar Sub-Modules (≈55 cm<sup>2</sup>) with >16% Efficiency by Controlling the Aggregation of an Engineered Non-Fullerene Acceptor.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)·2024
Same author

π-Conjugated Polymer with Pendant Side Chains as a Dopant-Free Hole Transport Material for High-Performance Perovskite Solar Cells.

ACS applied materials & interfaces·2024
Same author

Multifunctional Narrow Band Gap Terpolymer-Enabled High-Performance Dopant-Free Perovskite and Additive-Free Organic Solar Cells with Long-Term Stability.

ACS applied materials & interfaces·2023
Same journal

Turbulent flow in a vortex separator with a directed pipe inlet.

Scientific reports·2026
Same journal

Systematic characteristic evaluation of clay-based cementitious material derived from calcium carbide residue and waste tile powder.

Scientific reports·2026
Same journal

Retraction Note: Improvement of a rapid diagnostic application of monoclonal antibodies against avian influenza H7 subtype virus using Europium nanoparticles.

Scientific reports·2026
Same journal

Applying large language models to spam detection in the Kazakh low-resource language setting.

Scientific reports·2026
Same journal

An open-source 3D printing system enabling in-situ freeze-thaw processing of hydrogels.

Scientific reports·2026
Same journal

An enhanced EfficientNet framework for automated waste classification using cosine annealing and label smoothing.

Scientific reports·2026
See all related articles

Direct laser patterning of copper on polyimide using a 3D printer achieved cost-effective, defect-free patterns. Optimized focal length and scan gaps enhance conductivity and adhesion for flexible bioelectronics applications.

Area of Science:

  • Materials Science
  • Additive Manufacturing
  • Surface Engineering

Background:

  • Direct laser patterning offers a promising route for fabricating conductive microstructures.
  • Cost-effective methods are crucial for scaling up advanced materials processing.
  • Polyimide substrates are widely used in flexible electronics due to their thermal and mechanical properties.

Purpose of the Study:

  • To investigate cost-effective direct laser patterning of copper (Cu) on thin polyimide (PI) substrates.
  • To optimize laser process parameters, specifically focal length and scan gap, for improved Cu pattern quality and conductivity.
  • To evaluate the performance of patterned Cu for bioelectronic applications.

Main Methods:

  • Utilized a 405 nm laser module attached to an inexpensive 3D printer for direct laser patterning of Cu on PI (12.5-50 µm thickness).

More Related Videos

Hybrid Printing for the Fabrication of Smart Sensors
08:35

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

8.2K
Laser-induced Forward Transfer of Ag Nanopaste
08:07

Laser-induced Forward Transfer of Ag Nanopaste

Published on: March 31, 2016

11.4K

Related Experiment Videos

Last Updated: Aug 18, 2025

Planar and Three-Dimensional Printing of Conductive Inks
10:49

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

37.3K
Hybrid Printing for the Fabrication of Smart Sensors
08:35

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

8.2K
Laser-induced Forward Transfer of Ag Nanopaste
08:07

Laser-induced Forward Transfer of Ag Nanopaste

Published on: March 31, 2016

11.4K
  • Controlled laser focal length (shorter focal length - SFL, longer focal length - LFL) and scan gaps to minimize defects and surface damage.
  • Assessed Cu pattern resistivity, sheet resistance, and adhesion after cleaning, and demonstrated functionality in a wearable bioelectronic setup.

    • Main Results:

    • Achieved clean Cu line patterns without defects by controlling focal length (SFL: -2.4 mm, LFL: 3 mm relative to actual focal length).
    • Shorter focal length (SFL) resulted in lower resistivity (48 μΩ·cm) after one scan, while longer focal length (LFL) showed lower resistivity (70 μΩ·cm) after multiple scans.
    • Cu patterns fabricated with a 70 µm scan gap exhibited the lowest sheet resistance (4-4.4 Ω/ϒ) and improved adhesion after cleaning.
    • Demonstrated successful application in bioelectronics, with LEDs functioning on flexible PI substrates attached to skin, even under bending.

    Conclusions:

    • Direct laser patterning with optimized focal length and scan gaps provides a cost-effective method for high-quality copper conductive patterns on polyimide.
    • The process enables the fabrication of robust and conductive patterns suitable for flexible electronics and wearable bioelectronic devices.
    • This technique offers a scalable and efficient approach for producing functional conductive elements for emerging technologies.