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Updated: Aug 16, 2025

Surface Functionalization of Metal-Organic Frameworks for Improved Moisture Resistance
Published on: September 5, 2018
Molecular insight into on-surface chemistry of an organometallic polymer
Yuxuan Lin1, Mengxiao Diao1, Jingxin Dai1
1BNLMS, College of Chemistry and Molecular Engineering, Peking University, Beijing 100871, China. chenqw@pku.edu.cn.
Abstract:
A molecular investigation of Cu-elimination and subsequent C-C coupling of DCTP (4,4''-dichloro-1,1':3',1''-terphenyl)-Cu organometallic (OM) polymers on Cu(111) is conducted by scanning tunneling microscopy and spectroscopy, revealing that the Cu adatoms embedded in the DCTP-Cu chains are located at the hollow and bridge sites on the Cu(111) surface. The difference in the catalytic activities of these surface sites leads to stepwise elimination of Cu adatoms in the OM chains. Moreover, the interchain interaction plays an important role in the Cu-elimination process of the DCTP-Cu chains as well. The interchain steric hindrance, on the one hand, induces the formation of Cu-eliminated intermediates that are scarcely observed in other Ullmann coupling systems, and on the other hand, promotes the cooperative Cu-elimination and C-C coupling of the OM segments in neighboring chains. These findings demonstrate the key role of the molecule-substrate and intermolecular interactions in mediating the reaction processes of the extended molecular systems on the surface.
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