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Related Experiment Video

Updated: Aug 16, 2025

Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source

Measurement of Quantum Interference in a Silicon Ring Resonator Photon Source

Published on: April 4, 2017

Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs.

Ki Youl Yang^1,2, Chinmay Shirpurkar³, Alexander D White¹

¹E.L.Ginzton Laboratory, Stanford University, Stanford, CA, USA.

Nature Communications

|December 21, 2022

Summary

This summary is machine-generated.

We demonstrate a new silicon photonic circuit that combines wavelength- and mode-multiplexing for faster data transfer. This integrated multi-dimensional communication achieves 1.12 Tb/s error-free transmission, boosting silicon chip performance.

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Last Updated: Aug 16, 2025

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Area of Science:

Photonics and Optical Communications
Materials Science and Engineering

Background:

High-performance silicon chips face data transfer limitations.
Advancements in optical communication, particularly wavelength-division multiplexing, are crucial for increasing speed.
New data transfer dimensions are needed to meet growing bandwidth demands.

Purpose of the Study:

To demonstrate an integrated multi-dimensional communication scheme combining wavelength- and mode-multiplexing on a silicon photonic circuit.
To achieve high-speed, error-free data transmission for silicon nanophotonics.
To develop foundry-compatible devices for scalable optical interconnects.

Main Methods:

Utilized foundry-compatible photonic inverse design for device fabrication.
Employed spectrally flattened microcombs for data generation.
Implemented inverse-designed surface-normal couplers for chip-to-chip optical transmission.

Main Results:

Achieved 1.12 Tb/s natively error-free data transmission in a silicon nanophotonic waveguide.
Demonstrated multimode optical transmission between separate silicon chips using matched fiber.
All fabricated devices adhere to standard silicon photonic foundry process design rules.

Conclusions:

The integrated multi-dimensional communication scheme significantly enhances data transfer capabilities.
The developed approach is scalable and offers a multiplicative improvement over current silicon photonic transmitters.
This technology addresses the critical need for faster optical interconnects in high-performance computing.