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Laser ultrasonic imaging of complex defects with full-matrix capture and deep-learning extraction
Yujian Mei1, Jian Chen1, Yike Zeng1
1The State Key Laboratory of Fluid Power and Mechatronic Systems, School of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China.
Ultrasonics
|December 30, 2022
Summary
Laser ultrasonic imaging offers non-contact non-destructive evaluation for hazardous environments. This study adapted full matrix data acquisition and deep learning to improve imaging of complex defects, overcoming sensitivity limitations.
Area of Science:
- Materials Science
- Non-Destructive Evaluation
- Ultrasonic Imaging
Background:
- Traditional phased array ultrasonic imaging requires couplant, limiting use in hazardous environments and online monitoring.
- Laser ultrasonic (LU) technique offers non-contact inspection but suffers from low sensitivity and complex wave mode conversion.
Purpose of the Study:
- To develop laser-induced full-matrix ultrasonic imaging for complex defect characterization.
- To enhance LU imaging performance using full matrix data acquisition and deep learning.
Main Methods:
- Adapted full matrix data acquisition and deep learning algorithms to the laser ultrasonic technique.
- Conducted simulations and experiments on aluminum samples with representative defects.
- Utilized end-to-end deep learning networks for image reconstruction and quantitative analysis.
Main Results:
- Achieved excellent imaging performance for complex defects using the proposed laser ultrasonic method.
- Demonstrated good agreement between numerical simulations and experimental results.
- The deep learning method produced superior images with quantitative information compared to the traditional total focusing method.
Conclusions:
- The proposed couplant-free laser ultrasonic imaging method effectively visualizes complex defects.
- Deep learning significantly enhances imaging quality and provides quantitative defect assessment.
- This technique shows promise for early-stage defect detection in hazardous environments and in-situ manufacturing monitoring.

